The current trend in the electronics market is to seek solutions with ever-higher levels of integration at an ever lower cost. In this context, the System in Package (SiP) represents the ideal ...

System-in-package (SiP) is quickly emerging as the package option of choice for a growing number of applications and markets, setting off a frenzy of activity around new materials, methodologies, and ...

TL;DR: Broadcom has introduced its 3.5D eXtreme Dimension System in Package (XDSiP) technology, enabling AI customers to develop advanced custom accelerators. This platform integrates over 6000 mm² of ...

A new technical paper titled “Leveraging Modularity of Chiplets to Form a 4×4 Automotive FMCW-Radar in an eWLB-Package” was published by researchers at Ruhr University Bochum, Fraunhofer Institute, ...

Placement of regulators for core voltage levels closer to the chips that need them Usage of unique materials like ECMs in PCBs and packages to provide power rail capacitance Package-level and ...

Like any successful system-on-chip (SoC) effort, a multi-die system-in-package (SiP) project must start with a sound system design. But then what? Are the steps in the SiP design flow different from ...